Swiss-based technology company Oerlikon announced the successful placement of CHF 200 million senior unsecured bonds due in May 2031. According to the company’s statement, the proceeds from the bond issuance will be used for general corporate purposes, including the repayment of existing debt.
The annual coupon rate for the bonds was set at 2.125%, with the first payment scheduled for May 29, 2027. The company also announced that an application will be made for the bonds to be listed on the SIX Swiss Exchange, while provisional trading is expected to begin around May 27, 2026. Commerzbank, Bank J. Safra Sarasin, UBS Investment Bank and Zürcher Kantonalbank acted as Joint Lead Managers and Bookrunners in the transaction.
Operating in the fields of surface technologies and advanced materials, Oerlikon serves a wide range of industries including aerospace, automotive, energy, medical and semiconductors. The company generated sales revenue of CHF 1.6 billion in 2025.
